Test structures for MCM-D technology characterization

In this paper we present a set of classic and novel test structures address ed to fully characterize multichip module (MCM) technologies. The structure s have been implemented and fabricated in our D-type, flip-chip, ball grid array, silicon substrate technology. In this technology, a silicon chip is used as a substrate on which other commercial chips are flipped and soldere d by a screen-printing method. These complex technologies have specific tes t problems that are solved with this approach. We have specially focused on the measurement of the effects of wafer rerouting on CMOS parameters, the chip-to-chip ball contact resistance, thermal behavior, yield, and reliabil ity of the technology. Experimental results are shown, proving that this me thodology is suitable for our technology and can also he applied to other d ifferent MCM technologies.