Decentralized control of wafer temperature for multizone rapid thermal processing systems

Citation
Cd. Schaper et al., Decentralized control of wafer temperature for multizone rapid thermal processing systems, IEEE SEMIC, 12(2), 1999, pp. 193-199
Citations number
23
Categorie Soggetti
Eletrical & Eletronics Engineeing
Journal title
IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING
ISSN journal
08946507 → ACNP
Volume
12
Issue
2
Year of publication
1999
Pages
193 - 199
Database
ISI
SICI code
0894-6507(199905)12:2<193:DCOWTF>2.0.ZU;2-0
Abstract
Decentralized control is shown through analysis and experimentation to be a n appropriate strategy for wafer temperature control in certain multizone r apid thermal processing (RTP) systems. An input-output controllability anal ysis is conducted to illustrate that the direction associated with the refe rence command (set-point) corresponding to a spatially uniform temperature trajectory specification is nearly in alignment with the "most" controllabl e direction associated with the maximum singular value for a multiple conce ntric lamp configuration. Consequently, the control structure need not alte r the directionality of the plant and, thus, can be achieved by a simple de centralized controller where the lamps are paired individually to sensors t o achieve a multiloop structure where all interactions are not taken explic itly into account. This result is shown to produce acceptable performance e ven for an ill-conditioned plant since the directions corresponding to the smaller singular values are irrelevant to the uniform temperature control c riteria. Moreover, straightforward nonmodel-based tuning of the controller is enabled due to the simplicity of the decentralized control structure.