Integrated bake/chill for photoresist processing

A thermal cycling system for baking and chilling semi conductor wafers is p resented for photoresist processing applications, The proposed unit differs from conventional systems as the bake and chill steps are conducted sequen tially within the same module without substrate movement. The unit includes a circulating fluid that ran be switched between hot and cold reservoirs a nd serves as the dominant means for heat transfer. A set of thermoelectric devices is used in conjunction with the hot/cold fluid to provide a distrib uted amount of heat to the wafer for uniformity and transient temperature c ontrol. Experimental results are provided to demonstrate temperature unifor mity during both transient and steady-state operation.