Conjugate heat transfer analysis for the passive enhancement of electroniccooling through geometric modification in a mixed convection domain

Authors
Citation
Tc. Hung et Cs. Fu, Conjugate heat transfer analysis for the passive enhancement of electroniccooling through geometric modification in a mixed convection domain, NUM HEAT A, 35(5), 1999, pp. 519-535
Citations number
24
Categorie Soggetti
Mechanical Engineering
Journal title
NUMERICAL HEAT TRANSFER PART A-APPLICATIONS
ISSN journal
10407782 → ACNP
Volume
35
Issue
5
Year of publication
1999
Pages
519 - 535
Database
ISI
SICI code
1040-7782(199904)35:5<519:CHTAFT>2.0.ZU;2-3
Abstract
A two-dimensional model has been developed for numerical prediction of visc ous laminar flow, mixed convection, and conjugate heat transfer between par allel plates with uniform block heat sources and with openings on the integ rated circuit board. A control volume pressure-based finite difference nume rical scheme, PISO, is used to solve this problem. The differential pressur e below and above the openings of the board induces upward streams, which b reak the stagnant region between the blocks and, consequently, enhance the heat dissipation. Geometrically, parametric study has indicated that an ope ning at the appropriate location makes a flatter temperature distribution a nd a lower peak temperature. Because of the existence of both natural conve ction and opening-induced passive flow streams, the resulting flow field de pends on the inlet conditions and the magnitude of the heat source. The enh ancement of heal transfer is reflected by a global increase of Nusselt numb er on the blocks, and is especially apparent on the wind sides of the openi ngs.