System on chip or system on package?

Authors
Tummala, RR Madisetti, VK
Citation
Rr. Tummala et Vk. Madisetti, System on chip or system on package?, IEEE DES T, 16(2), 1999, pp. 48-56
Citations number
5
Categorie Soggetti
Computer Science & Engineering
Journal title
IEEE DESIGN & TEST OF COMPUTERS
ISSN journal
07407475 → ACNP
Volume
16
Issue
2
Year of publication
1999
Pages
48 - 56
Database
ISI
SICI code
0740-7475(199904/06)16:2<48:SOCOSO>2.0.ZU;2-L
Abstract
The authors propose a new system design paradigm, the system on package, wh ich uses electronic product reengineering to meet time-to-market and perfor mance requirements. The system on package promises a higher return on inves tment than the system on chip.