Microfabrication of half-wave rectifier circuits using soft lithography

This paper describes the fabrication of half-wave rectifier circuits using soft lithography. The fabrication process involved two steps of pattern tra nsfer using micromolding in capillaries (MIMIC), and one step using microco ntact printing (mu CP); two steps required pattern registration. This proce dure, with its yield of similar to 90%, demonstrates that soft lithography is compatible with multilayer fabrication, for this type of device. The cha racteristics at room temperature of the circuits generated using soft litho graphy were indistinguishable from those fabricated by conventional photoli thography. (C) 1999 Elsevier Science S.A. All rights reserved.