Mechanical and thermal effects in grinding of advanced ceramics

Citation
Hk. Tonshoff et al., Mechanical and thermal effects in grinding of advanced ceramics, INT J JPN P, 33(1), 1999, pp. 32-36
Citations number
8
Categorie Soggetti
Mechanical Engineering
Journal title
INTERNATIONAL JOURNAL OF THE JAPAN SOCIETY FOR PRECISION ENGINEERING
ISSN journal
0916782X → ACNP
Volume
33
Issue
1
Year of publication
1999
Pages
32 - 36
Database
ISI
SICI code
0916-782X(199903)33:1<32:MATEIG>2.0.ZU;2-H
Abstract
This paper presents the results of grinding experiments and the characteris ation of subsurface damage of different advanced ceramics due to the grindi ng process. In order to understand the influence on material removal and su rface integrity of the mechanical and thermal effects, different investigat ions were done. To change the thermomechanical effects of the grinding proc ess, the machine settings were changed successively as well as the grinding wheels (diamond grain size). Grinding experiments with heated workpieces w ere performed in order to change the material properties. Besides conventio nal X-ray measurements, the results of stress gradients will be discussed.