A thin layer of gold grown epitaxially in a 3C-SiC/Si interface is observed
using conventional (CTEM) and high-resolution electron microscopy (HREM) m
ethods. This interlayer was formed after an extended thermal treatment, at
500 degrees C for 500 h, of a 3C-SiC/Si system on which Au was deposited on
the surface of SiC for the formation of a Schottky diode. Misfit dislocati
ons are observed in both SiC/Au and Au/Si interfaces having Burgers vectors
b = 1/2[(1) over bar 10] parallel to the interfaces. Such an epitaxy is ma
de in spite of the very high misfit in the Au/Si interface. The net of the
misfit dislocations is visible only by cross-section HREM observations. The
position of the extra half-planes of the interfacial dislocations is illus
trated. An explanation for the mechanism of the Au mass transport through t
he unaffected SiC film is given. This is attributed to pipe diffusion throu
gh the partial dislocations bounding the stacking faults and inversion doma
in boundaries that pre-exist in 3C-SiC. The same diffusion mechanism allows
the transport of Si from the 3C-SiC/Si interface to the top surface of SIC
on which islands of Si and Au are formed. (C) 1999 Elsevier Science B.V. A
ll rights reserved.