Citation
G. Sarkar et al., Endurance of thermoset resins for flip chip encapsulation, J MAT SCI L, 18(5), 1999, pp. 423-424
Citations number
7
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science","Material Science & Engineering
Journal title
JOURNAL OF MATERIALS SCIENCE LETTERS
ISSN journal
02618028
→ ACNP
Volume
18
Issue
5
Year of publication
1999
Pages
423 - 424
Database
ISI
SICI code
0261-8028(19990301)18:5<423:EOTRFF>2.0.ZU;2-L