Hydrogen plasma pretreatment effect on the deposition of aluminum thin films from metalorganic chemical vapor deposition using dimethylethylamine alane

Citation
Tw. Jang et al., Hydrogen plasma pretreatment effect on the deposition of aluminum thin films from metalorganic chemical vapor deposition using dimethylethylamine alane, J VAC SCI A, 17(3), 1999, pp. 1031-1035
Citations number
15
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science","Material Science & Engineering
Journal title
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS
ISSN journal
07342101 → ACNP
Volume
17
Issue
3
Year of publication
1999
Pages
1031 - 1035
Database
ISI
SICI code
0734-2101(199905/06)17:3<1031:HPPEOT>2.0.ZU;2-S
Abstract
To study the effect of pretreatment of substrates on the deposition behavio r of Al thin films, the surfaces of TiN and SiO2 substrates were exposed to hydrogen plasma or Ar plasma before Al deposition. The Al films were depos ited by the pyrolysis of dimethylethylamine alane (DMEAA). A uniform Al fil m was deposited by the hydrogen plasma exposure to a SiO2 substrate, while island grains were grown by the Ar plasma exposure. The pretreatments of a TiN substrate did not affect the deposition rate of the Al film. The concen tration of OH radicals at the SiO2 surface was increased by the hydrogen pl asma treatment. We suggest a model in which OH radicals enhance the adsorpt ion of DMEAA on a SiO2 surface, resulting in a larger number of nucleation sites. (C) 1999 American Vacuum Society. [S0734-2101(99)04003-8].