Kinetic roughening in electrodissolution of copper

We studied kinetic roughening of copper surfaces electrochemically dissolve d at constant current densities by atomic force microscopy. The surface was found to roughen with time and the surface width increased with the length scale with the roughness exponent alpha of 0.73+/-0.05 in the stationary s tate. This value is different from that in electrochemical deposition, 0.87 , under the stable growth condition [A. Iwamoto el nl., Phys. Rev. Lett. 72 , 4025 (1994)]. The observed roughening in the dissolution process is discu ssed in terms of nonlocal effects. [S1063-651X(99)11305-9].