The presence of tape debris at the head-tape interface can cause an increas
e in spacing and consequently an increase in signal loss. In this study, th
e generation of tape debris in linear tape drives is analysed. Functional d
rive tests are conducted using thin-film Al2O3-TiC and Ni-Zn ferrite heads
run against commercial metal particle (MP) tape. Three types of tape debris
are found: magnetic particle rich, polymer rich and adherent (stain). Each
type is found at a distinct location on the head surface. Optical microsco
py and computerized image analysis are used both to quantify the tape debri
s and to find its distribution on the head. Atomic force microscopy is used
to measure the thickness of adherent debris. The Al2O3-TiC sample generate
s more of all three types than does the Ni-Zn ferrite sample. This is proba
bly a result of the higher hardness of Al2O3-TiC. The differential wear of
Al2O3 and TiC probably accounts for the presence of adherent debris on the
Al2O3-TiC head. No adherent debris can be found on the Ni-Zn ferrite head.
Since the adherent debris collects near the pole tip and is difficult to re
move, it potentially poses the greatest head-tape spacing problem, even tho
ugh its thickness is only of the order of a few nanometres. A relationship
is found between the generation of loose debris and the tape speed, tape te
nsion and head wrap. Loose debris generation increases as the tape speed de
creases and as the tape tension and head wrap increase. Its generation is f
ound to be approximately proportional to the frictional force. Loose debris
, especially the magnetic-particle-rich type, continues to be generated in
abundant amounts beyond the burnishing phase for MP tape. The use of an abr
asive tape leader is found to reduce the amount of debris at the interface.