Diamond junction field effect transistors (FETs) utilizing delta-boron-dope
d diamond films were fabricated and analyzed. In order to allow full charge
modulation by the gate, the total channel sheet charge must not exceed the
order of 10(13) cm(-2). However, boron doping shows full activation only f
or concentrations above ca 10(20) cm(-3) [1]. This yields a thickness for a
fully activated channel in the range of ca 1 nm. To approach such narrow d
oping spikes any parasitic boron doping tails need to be eliminated. One po
ssible way of achieving this is to compensate boron doping with nitrogen do
ping, an extremely deep donor. This results in the formation of a pn-juncti
on, where the nitrogen doped part is not activated at room temperature and
which therefore represents a semi-insulating (lossy) dielectric at low temp
erature and high frequency. At elevated temperature and low frequency the n
itrogen doped layer becomes conducting acting as a series resistor to the i
nterfacial pn-junction. Using this concept of a lossy dielectric pn-junctio
n in the delta-doped channel FET, two gate diode configurations were invest
igated. In the first the nitrogen doped (Ib) synthetic diamond substrate se
rved as a large area back gate, while in the second the nitrogen doped gate
layer was grown on top of the delta-channel. The devices show high drain c
urrents of up to 100 mA mm(-1) and full channel modulation even at moderate
operation temperatures of 200-250 degrees C. By extrapolation a current de
nsity of 1 A mm(-1) is expected for a 0.25 mu m gate length device. (C) 199
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