An InP-based normally-off superlattice-insulated-gate field-effect transist
or (SIGFET) with a T-shaped gate structure has been developed using an angl
ed self-aligned implant process. The spacing to the nf source/drain regions
created with this new process increases:the breakdown voltage and lowers t
he gate capacitance. It also reduces the short channel effect while a high
g(m) value is maintained. A cutoff frequency f(T) of 45 GHz was obtained fo
r the SIGFET with 0.56 mu m gate length.