Heat analysis of thermal overload relays using 3-D finite element method

Citation
Y. Kawase et al., Heat analysis of thermal overload relays using 3-D finite element method, IEEE MAGNET, 35(3), 1999, pp. 1658-1661
Citations number
3
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science
Journal title
IEEE TRANSACTIONS ON MAGNETICS
ISSN journal
00189464 → ACNP
Volume
35
Issue
3
Year of publication
1999
Part
1
Pages
1658 - 1661
Database
ISI
SICI code
0018-9464(199905)35:3<1658:HAOTOR>2.0.ZU;2-8
Abstract
In designing a thermal overload relay, it is necessary to analyze thermal c haracteristics of several trial models. Up to now, this has been done by me asuring the temperatures on a number of positions in the trial models. This experimental method is undoubtedly expensive. In this paper, the temperatu re distribution of a thermal overload relay is obtained by using 3-D finite element analysis faking into account the current distribution in current-c arrying conductors, It is shown that our 3-D analysis is capable of evaluat ing a new design of thermal overload relays.