Processing of materials at microwave frequencies is made difficult by physi
cal properties that change significantly with temperature. A microwave heat
ing model with material properties that change slowly with time and tempera
ture has been developed. A frequency domain finite element solution of the
electric field is coupled to time domain finite element diffusion equation
to study the evolution of temperature profiles. The temperature change is d
etermined from the balance of power dissipation, thermal diffusion, and the
rmal convection.