Stress-induced leakage current (SILC) has been recognized as a topic of con
cern in flash memory reliability. It is a reliable failure mechanism, occur
ring long before oxide breakdown and, hence, limiting oxide lifetime [1]. T
he physical origin and mechanisms of SILC have not yet been clearly underst
ood and several points open to discussion remain. In this work the role of
oxide hole fluence in producing the SILC is discussed. An universal power l
aw of SILC generation kinetics is proposed versus the hole fluence througho
ut the oxide. The experimental results are theoretically validated by model
ing the measured quantum-yield by the contributions of both anode hole inje
ction and electron valence band injection mechanisms. (C) 1999 Elsevier Sci
ence Ltd. All rights reserved.