Measurement and modeling of the annealing kinetics of stress induced leakage current in ultra-thin oxides

Citation
P. Riess et al., Measurement and modeling of the annealing kinetics of stress induced leakage current in ultra-thin oxides, MICROEL REL, 39(2), 1999, pp. 203-207
Citations number
8
Categorie Soggetti
Eletrical & Eletronics Engineeing
Journal title
MICROELECTRONICS RELIABILITY
ISSN journal
00262714 → ACNP
Volume
39
Issue
2
Year of publication
1999
Pages
203 - 207
Database
ISI
SICI code
0026-2714(199902)39:2<203:MAMOTA>2.0.ZU;2-L
Abstract
The annealing properties of the stress induced leakage current (SILC) for 5 5 and 65 Angstrom thick oxides are investigated. It is demonstrated that th e SILC is a fully reversible degradation process and that its generation ki netics are nearly unchanged after successive stressing/annealing cycles, Th e activation energy and diffusion coefficient of the annealing process has been extracted and shown to be independent of oxide thickness. Moreover the annealing kinetics are quantitatively simulated using a drift-diffusion mo del with the experimentally extracted parameters. (C) 1999 Elsevier Science Ltd. All rights reserved.