Low pressure chemical vapor deposition from TEOS-NH3 mixtures: thermochemical study of the process considering kinetic data

Citation
C. Vahlas et al., Low pressure chemical vapor deposition from TEOS-NH3 mixtures: thermochemical study of the process considering kinetic data, MICROEL REL, 39(2), 1999, pp. 303-309
Citations number
15
Categorie Soggetti
Eletrical & Eletronics Engineeing
Journal title
MICROELECTRONICS RELIABILITY
ISSN journal
00262714 → ACNP
Volume
39
Issue
2
Year of publication
1999
Pages
303 - 309
Database
ISI
SICI code
0026-2714(199902)39:2<303:LPCVDF>2.0.ZU;2-3
Abstract
A calculational thermodynamic investigation of the chemical vapor depositio n (CVD) of SiO2 films from TEOS/NH3 mixtures has been performed, by minimiz ing the Gibbs energy of the C-H-N-O-Si chemical system. Calculations are ba sed on an upgraded thermodynamic data bank which includes silicon containin g complex gaseous compounds. The obtained results illustrate the influence of temperature, of pressure, and of initial gas composition on the formatio n of stable phases. Partial equilibrium calculations were also performed, i n order to investigate the predominant mechanisms for deposition. These cal culations have been conducted (a) by excluding the solid phases from the ca lculations, and (b) by assuming a partial striping and elimination of the e thoxy ligands in the gas phase before reaching the growing surface. Finally , the supersaturation of the gas phase relative to silicon dioxide and the corresponding driving force for the deposition have been evaluated in diffe rent processing conditions. A direct relation between driving force and the growth rate of the deposits has thus been evidenced. The aim of this research is to contribute to the definition of optimum cond itions for the processing of materials which can be used as dielectrics in integrated circuits, and as waveguides in optoelectronics. (C) 1999 Elsevie r Science Ltd. All rights reserved.