Comparative study of thermally conductive fillers for use in liquid encapsulants for electronic packaging

Thermal management plays a very vital role in the packaging of high perform ance electronic devices. Effective heat dissipation is crucial to enhance t he performance and reliability of the packaged devices. Liquid encapsulants used for glob top, potting, and underfilling applications can strongly inf luence the package heat dissipation. Unlike molding compounds, the filler l oading in these encapsulants is restrained, This paper deals with the devel opment and characterization of thermally conductive encapsulants with relat ively low filler loading. A comparative, study on the effect of different c eramic fillers on the thermal conductivity and other critical properties of an epoxy based liquid encapsulant is presented.