Kinematics analysis of the chipping process using the circular diamond sawblade

One of the primary goals in the design of a diamond blade cutting system is to reduce the cutting force. By understanding the fundamentals of the kine matics of the sawing operation, these forces can be lowered and even optimi zed with respect to the machining parameters. In this work the material chi pping geometries have been mathematically defined and derived through kinem atic analysis. These geometries are bounded by four curves and depend on th e parameters: depth of cut h, blade diameter D, transverse rate of the work piece upsilon(T), peripheral speed of the saw blade upsilon(P), and grit sp acing lambda. From these chipping geometries, chip area and thickness relat ions have been obtained. A relation for the mean chip thickness to grit spa cing ratio (t(C)/lambda) has also been obtained as a function of the nondim ensional machining parameter ratios, h/D and upsilon(T)/upsilon(P). The eff ects of these parameters on t(c) were also investigated It was found that i ncreasing omega and D, reduces the chip thickness. Contrarily, increasing u psilon(T), lambda, and h, increases the magnitude of the chip thickness. A review of older chipping models was performed, comparing well with the de veloped model. The results show an excellent agreement between the new mode l and the older ones. However, at moderately small to large h/D values the new model yields a more exact result. Thus, for h/D values greater than 0.0 8, it is recommended that the kinematic model be used to compute t(c) and o ther pertinent sawing parameters (i.e., grit force and grinding ratio) whic h are a function of t(c).