Evaluation of fatigue crack initiation and extension life in microelectronics solder joints of surface mount type

Fatigue tests on solder joints of surface mount type electronic package mod els were carried out at different temperatures, cycling frequencies and con trolled displacement amplitudes in order to examine the crack initiation li fe Nc, crack extension rate da/dN, crack extension path and crack extension life. The crack initiation life (Nc)(cat) of solder joints was estimated u sing maximum equivalent inelastic strain calculated by three-dimensional el asto-inelastic finite element method (3D-FEM). The ratios Nc/(Nc)(cal) were found 2.4 - 9.8. Further, 2D-FEM crack extension analyses were performed t o examine crack extension behavior. The FEM analyses showed that crack exte nsion path and rate were controlled by maximum opening stress range at crac k tip, Delta sigma(theta max), in plastic zone under rather complicated str ess tensor field, Experimentally obtained crack extension rate was found to be related to Delta sigma(theta max) in FEM analysis as da/dN = beta[Delta sigma(theta max)](alpha), with alpha = 2.0 and beta = 2.65 x 10(-10) mm(5) /N-2 being determined independently of the test conditions. The calculated values of crack extension life by the FEM analyses using the above equation were in good agreement with the experimental ones.