Reduction of voiding in eutectic ball grid array solder joints

Authors
Citation
W. Casey, Reduction of voiding in eutectic ball grid array solder joints, SOLDER S MT, 11(2), 1999, pp. 12-16
Citations number
4
Categorie Soggetti
Eletrical & Eletronics Engineeing
Journal title
SOLDERING & SURFACE MOUNT TECHNOLOGY
ISSN journal
09540911 → ACNP
Volume
11
Issue
2
Year of publication
1999
Pages
12 - 16
Database
ISI
SICI code
0954-0911(1999)11:2<12:ROVIEB>2.0.ZU;2-6
Abstract
The rapid progress of bail grid array (BGA) component technology has served to alleviate many problems associated with the placement and soldering of high lead count, fine pitch surface mount technology (SMT) packages. An unf ortunate result of this process, however. is the occurrence of voids in the interconnecting eutectic solder balls of these packages. Large voids can a ffect the mechanical and thermal properties of the interconnect, which can reduce a component's mean time-to-failure and may also affect the transmiss ion of high frequency electrical signals through the solder ball. For this reason, several experiments were conducted to investigate the manner and me chanisms in which voids are introduced into eutectic EGA solder ball joints . The following process parameters were found to be the primary parameters responsible for the voiding phenomenon: condition of the component's alloy and substrate, oxygen concentration in the reflow atmosphere, solder paste properties and the reflow profile. Through modification and optimization of process parameters in the manufacturing environment, EGA solder joint void ing was greatly reduced.