TMA, DMA, DSC and TGA of lead free solders

Most of the electronics packaging materials, especially solders, are temper ature dependent temperature-dependent material properties can be obtained b y TMA (thermal mechanical analysis), DMA (dynamic mechanical analysis), DSC (differential scanning calorimetry), and TGA (thermogravimetric analysis). In this study, the thermal coefficient of expansion (TCE), storage modulus , moisture uptake, and melting point of two lead free solders, 96.5wt%Sn-3. 5wt%Ag and 42wt%Sn-58wt%Bi provided from two different vendors, are measure d by, respectively, TMA, DMA, TGA, and DSC. For comparison purpose, the 63w t%Sn37wt%Pb solder is also considered.