Energy transmission by inductive coupling of a pair of coils is used for wi
reless microsystems, when battery-operated microsystems are not desirable.
The on-chip coils affect the sq,stern's read and write distances. This pape
r presents the optimization of coils manufactured by 3D UV depth lithograph
y and electroplating. The effects of using copper rather than gold as coil
material and the use of an optimum insulation layer are described. The infl
uence of different on-chip coil designs is shown by modeling and by measure
ments.