Optimization of on-chip coil for wireless microsystems

Citation
M. Weser et al., Optimization of on-chip coil for wireless microsystems, TEC MES, 66(5), 1999, pp. 203-208
Citations number
13
Categorie Soggetti
Instrumentation & Measurement
Journal title
TECHNISCHES MESSEN
ISSN journal
01718096 → ACNP
Volume
66
Issue
5
Year of publication
1999
Pages
203 - 208
Database
ISI
SICI code
0171-8096(199905)66:5<203:OOOCFW>2.0.ZU;2-M
Abstract
Energy transmission by inductive coupling of a pair of coils is used for wi reless microsystems, when battery-operated microsystems are not desirable. The on-chip coils affect the sq,stern's read and write distances. This pape r presents the optimization of coils manufactured by 3D UV depth lithograph y and electroplating. The effects of using copper rather than gold as coil material and the use of an optimum insulation layer are described. The infl uence of different on-chip coil designs is shown by modeling and by measure ments.