With a special micromachining process ultrasound transducers can be realize
d within a standard CMOS microelectronic process, allowing the monolithic i
ntegration? of microelectronics and micromechanics on a single chip. The el
ectrostatic transducer is formed by an army of membranes.
For air-ultrasonics ics a bulk-micromachining-process was developed which i
s best suited for transducers with operating frequencies below I MHz.