The precise crystallographic orientation of InP wafers is revealed using a
crystalign pattern that is etched for a short time. A device pattern can th
en be aligned to the manifested direction. Alignment of V-grooves for preci
se cleaving of side emitting lasers is demonstrated with a precision of 0.0
63 degrees. (C) 1999 The Electrochemical Society. S1099-0062(99)03-053-9. A
ll rights reserved.