MOS C-V characterization of ultrathin gate oxide thickness (1.3-1.8 nm)

Citation
Ch. Choi et al., MOS C-V characterization of ultrathin gate oxide thickness (1.3-1.8 nm), IEEE ELEC D, 20(6), 1999, pp. 292-294
Citations number
6
Categorie Soggetti
Eletrical & Eletronics Engineeing
Journal title
IEEE ELECTRON DEVICE LETTERS
ISSN journal
07413106 → ACNP
Volume
20
Issue
6
Year of publication
1999
Pages
292 - 294
Database
ISI
SICI code
0741-3106(199906)20:6<292:MCCOUG>2.0.ZU;2-9
Abstract
An equivalent circuit approach to MOS capacitance-voltage (C-V) modeling of ultrathin gate oxides (1.3-1.8 nm) is proposed, Capacitance simulation inc luding polysilicon depletion is based on quantum mechanical (QM) correction s implemented in a two-dimensional (2-D) device simulator; tunneling curren t is calculated using a one-dimensional (1-D) Green's function solver, The sharp decrease in capacitance observed for gate oxides below 2.0 nm in both accumulation and inversion is modeled using distributed voltage-controlled RC networks. The imaginary components of small-signal input admittance obt ained from AC network analysis agree well with measured capacitance.