This paper presents a high-speed and low-power SRAM for portable equipment,
which is operated by a single battery cell of around 1 V, Its memory cells
are made up of high-threshold-voltage (high-V-th) MOSFET's in order to sup
press the power dissipation due to large subthreshold leakage currents. For
designing peripheral circuitry, we use SRAM's special feature that input s
ignals of each logic gate during the standby time can be predicted. Low-V-t
h MOSFET's are assigned for the critical paths of memory-cell access. The l
eakage current in each logic gate is reduced by high-V-th MOSFET's, which a
re cut off during standby, The high-V-th MOSFET in one logic gate can be sh
ared with another logic gate in order to enlarge effective channel width, T
o shorten the readout time, a step-down boosted-wordline scheme suitable fo
r current-sense readout and a new half-swing bidirectional double-rail bus
are used. The data-writing time is halved by means of a pulse-reset wordlin
e architecture. To reduce the power dissipation, a 32-divided memory array
structure is employed with a new redundant address-decoding scheme, Also, d
ata transition detectors and a charge-recycling technique are employed for
reducing the power dissipation of data-I/O buffers. A 64-K-words x 16-bits
SRAM test chip, which was fabricated with a 0.5-mu m multithreshold voltage
CMOS (MTCMOS) process, has demonstrated a 75-ns address access time at a 1
-V power supply, The power dissipation during standby is 1.2 mu W, and that
at a 10-MHz read operation with the modified checkerboard test pattern is
3.9 mW for 30-pF loads.