Testing techniques based on the functional behaviour, the propagation delay
and the levels of quiescent current have been used with great success for
the last two decade technologies. However, the efficiency of such technique
s is dubious for future technologies, characterised by huge mixed-mode comp
lex circuits and very low supply voltage levels. In this paper the feasibil
ity of using internal thermal sensors to detect heat sources provoked by st
ructural defects are considered and evaluated.