POWDER INJECTION-MOLDING AND INFILTRATION SINTERING OF SUPERFINE GRAIN W-CU

Authors
Citation
B. Yang et Rm. German, POWDER INJECTION-MOLDING AND INFILTRATION SINTERING OF SUPERFINE GRAIN W-CU, International journal of powder metallurgy, 33(4), 1997, pp. 55
Citations number
6
Categorie Soggetti
Metallurgy & Metallurigical Engineering
ISSN journal
08887462
Volume
33
Issue
4
Year of publication
1997
Database
ISI
SICI code
0888-7462(1997)33:4<55:PIAISO>2.0.ZU;2-T
Abstract
infiltration sintering of W-10w/oCu, W-15w/oCu and W-20w/oCu composite s has been evaluated for ball milled superfine W powder and Cu powder after die compaction or powder injection molding. High sintered proper ties have been obtained. for example, relative sintered densities were about 99.2% of theoretical with Vickers' hardness levels of Hv200, 40 5, and 366 for W-10w/oCu, W-15w/oCu and W-20w/oCu respectively. Green bars with a powder loading of 52v/o for tensile and three-point bend s amples have been formed successfully by powder injection molding. A re lative density near 99%, transverse rupture strength near 1500MPa, and a fine grain microstructure have been obtained for the PIM and infilt ration-sintered W-15w/oCu alloy.