B. Yang et Rm. German, POWDER INJECTION-MOLDING AND INFILTRATION SINTERING OF SUPERFINE GRAIN W-CU, International journal of powder metallurgy, 33(4), 1997, pp. 55
infiltration sintering of W-10w/oCu, W-15w/oCu and W-20w/oCu composite
s has been evaluated for ball milled superfine W powder and Cu powder
after die compaction or powder injection molding. High sintered proper
ties have been obtained. for example, relative sintered densities were
about 99.2% of theoretical with Vickers' hardness levels of Hv200, 40
5, and 366 for W-10w/oCu, W-15w/oCu and W-20w/oCu respectively. Green
bars with a powder loading of 52v/o for tensile and three-point bend s
amples have been formed successfully by powder injection molding. A re
lative density near 99%, transverse rupture strength near 1500MPa, and
a fine grain microstructure have been obtained for the PIM and infilt
ration-sintered W-15w/oCu alloy.