Electrical resistivity of Cu and Nb thin films and multilayers

Citation
M. Fenn et al., Electrical resistivity of Cu and Nb thin films and multilayers, J MAGN MAGN, 199, 1999, pp. 231-232
Citations number
6
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science
Journal title
JOURNAL OF MAGNETISM AND MAGNETIC MATERIALS
ISSN journal
03048853 → ACNP
Volume
199
Year of publication
1999
Pages
231 - 232
Database
ISI
SICI code
0304-8853(199906)199:<231:EROCAN>2.0.ZU;2-W
Abstract
We have measured the resistivity, temperature coefficient of resistivity (T CR) and grain sizes in single films of Cu and Nb as a function of film thic kness. We have compared our experimental results with the predictions of th e theory due to Dimmich. This theory allows us to extract a value for grain boundary reflectivity, R, which is subsequently used in the analysis of th e resistivity and TCR of Cu/Nb multilayers. We present our values for grain boundary reflectivity and the subsequent fit to the experimental resistivi ty and TCR using Dimmich's equations. (C) 1999 Elsevier Science B.V. All ri ghts reserved.