Palladium composite membranes by electroless plating technique - Relationships between plating kinetics, film microstructure and membrane performance

Citation
Kl. Yeung et al., Palladium composite membranes by electroless plating technique - Relationships between plating kinetics, film microstructure and membrane performance, J MEMBR SCI, 159(1-2), 1999, pp. 107-122
Citations number
37
Categorie Soggetti
Chemistry,"Chemical Engineering
Journal title
JOURNAL OF MEMBRANE SCIENCE
ISSN journal
03767388 → ACNP
Volume
159
Issue
1-2
Year of publication
1999
Pages
107 - 122
Database
ISI
SICI code
0376-7388(19990701)159:1-2<107:PCMBEP>2.0.ZU;2-S
Abstract
Thin supported palladium membranes were prepared using electroless plating technique. The intrinsic plating kinetics were determined for hydrazine-bas ed palladium plating baths. Mathematical models were developed to predict f ilm thickness and plating rate as a function of plating parameters (i.e., r eactant concentrations, temperature and time). Analyses of film surface mic rostructure indicate that grain structure is dependent on both plating chem istry and plating rate. The evolution of film morphology during electroless plating was also investigated. Hydrogen permeation study demonstrated that film structure has a significant influence on the permeation performance o f the palladium membrane. (C) 1999 Elsevier Science B.V. All rights reserve d.