Measurement of thermal conductivity using TMDSC: Solution to the heat flowproblem

Citation
Sl. Simon et Gb. Mckenna, Measurement of thermal conductivity using TMDSC: Solution to the heat flowproblem, J REINF PL, 18(6), 1999, pp. 559-571
Citations number
8
Categorie Soggetti
Material Science & Engineering
Journal title
JOURNAL OF REINFORCED PLASTICS AND COMPOSITES
ISSN journal
07316844 → ACNP
Volume
18
Issue
6
Year of publication
1999
Pages
559 - 571
Database
ISI
SICI code
0731-6844(1999)18:6<559:MOTCUT>2.0.ZU;2-H
Abstract
The dependence of the apparent heat capacity obtained from quasi-isothermal temperature-modulated differential scanning calorimetry (TMD$C) experiment s and the thermal conductivity is determined for several cases. The relatio nships are based on the solution of the heat conduction equation which give s the temperature profile in the TMDSC sample. The temperature profile is t hen used to calculate the sinusoidal heat flow to the sample. We compare ou r results with those of other researchers. We also show the effect of therm al contact resistance on the results.