Enhanced heat transfer in tight space - A frontier for thermal management of microelectronic equipment

Microelectronic equipment at extreme ends of the product spectrum - superco mputers on high end and portable computers on low end - are facing a common challenge in heat transfer engineering, namely, removal of increasingly la rge amounts of heat from constrained space. This paper reviews the cooling technologies focusing on their efficiency in space-constrained heal transfe r. Also, some practical issues involved in the design of microchannel cooli ng systems are discussed.