The leakage current effect of thin gate oxides (2.4-2.7 nm) with in situ native oxide desorption

Citation
Jm. Lai et al., The leakage current effect of thin gate oxides (2.4-2.7 nm) with in situ native oxide desorption, J ELCHEM SO, 146(6), 1999, pp. 2216-2218
Citations number
12
Categorie Soggetti
Physical Chemistry/Chemical Physics","Material Science & Engineering
Journal title
JOURNAL OF THE ELECTROCHEMICAL SOCIETY
ISSN journal
00134651 → ACNP
Volume
146
Issue
6
Year of publication
1999
Pages
2216 - 2218
Database
ISI
SICI code
0013-4651(199906)146:6<2216:TLCEOT>2.0.ZU;2-P
Abstract
An intrinsic defect may exist in thin gate oxides. Such a defect can increa se the leakage current in a manner similar to stress-induced leakage curren t. In this paper, we have shown that the effect of this intrinsic defect ca n be greatly reduced by in situ removal of the native oxide followed by gro wing a high-quality thermal oxide. By using such in situ cleaning, ultrathi n oxides can be prepared with atomically smooth interfaces, good thickness uniformity, and reduced leakage currents. (C) 1999 The Electrochemical Soci ety. All rights reserved.