I. Banerjee et al., Characterization of chemical vapor deposited amorphous fluorocarbons for low dielectric constant interlayer dielectrics, J ELCHEM SO, 146(6), 1999, pp. 2219-2224
C-F materials, deposited by chemical vapor deposition (CVD) have been studi
ed for their potential use as a low dielectric constant intermetal dielectr
ic material for semiconductor applications. Though a dielectric constant of
similar to 2.4 has been determined, thermal stability of the material need
s to be improved. It is shown that the presence of O and/or OH in the syste
m causes a pyrolytic decomposition of the material causing CO and CO2 to ou
tgas from the material at low temperatures. This causes the C-F matrix to d
isintegrate and release CFx ions. Minimizing the O/OH content in the films
improves thermal stability. Various structural properties of the films have
been investigated using X-ray photoelectron spectroscopy and nuclear magne
tic resonance spectroscopies. (C) 1999 Intel Corporation.