Atomic layer epitaxy of copper: an ab initio investigation of the CuCl/H-2process - II. Reaction energies

Citation
P. Martensson et al., Atomic layer epitaxy of copper: an ab initio investigation of the CuCl/H-2process - II. Reaction energies, APPL SURF S, 148(1-2), 1999, pp. 9-16
Citations number
22
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science","Material Science & Engineering
Journal title
APPLIED SURFACE SCIENCE
ISSN journal
01694332 → ACNP
Volume
148
Issue
1-2
Year of publication
1999
Pages
9 - 16
Database
ISI
SICI code
0169-4332(199906)148:1-2<9:ALEOCA>2.0.ZU;2-S
Abstract
Reaction energies for different reaction pathways in the CuCl/H-2 process o ccurring in the gas phase as well as on a Cu(111) surface have been calcula ted using Density Functional Theory. All reactions, occurring in the gas ph ase as well as in the solid/vapour interface where gaseous atomic hydrogen was used as reducing agent were highly exothermic with reaction energies be tween approximately -200 and -300 kJ mol(-1). When molecular hydrogen was u sed, the reactions were endothermic. A gas phase reaction had a reaction en ergy of about 100 kJ mol(-1), whereas for reactions between adsorbed CuCl a nd gaseous H-2, this value decreased to between 32 and 64 kJ mol(-1) depend ing on reaction pathway. This was slightly lower than for surface reactions between CuCl and hydrogen where the reaction energies varied between 53 an d 88 kJ mol(-1). (C) 1999 Elsevier Science B.V. All rights reserved.