Jj. Schubbe et S. Mall, Modeling of cracked thick metallic structure with bonded composite patch repair using three-layer technique, COMP STRUCT, 45(3), 1999, pp. 185-193
A finite element analysis involving three-layers of two-dimensional Mindlin
plate elements, to model cracked plate, adhesive, and composite patch, was
developed to characterize fatigue crack growth behavior of a thick metalli
c panel repaired with an adhesively bonded composite patch. Also, fatigue e
xperiments were conducted with 6.35 mm thick specimens with a pre-crack rep
aired asymmetrically with adhesively bonded unidirectional boron/epoxy patc
h. Fatigue crack growth rates on the unpatched and patched faces (PF) were
measured along with debond of the composite patch. Stress intensity factors
obtained from the analysis were combined with the fatigue crack growth rel
ationship for the unrepaired cracked material to obtain the analytical fati
gue crack growth rates. The experimental and analytical fatigue crack growt
h rates on the unpatched face (UPF) were in a good agreement with each othe
r when the proper consideration of the effective crack length and debond we
re incorporated in the analysis. Thus, the three-layer technique was found
to be capable of characterizing the fatigue crack growth behavior of the re
paired thick panels as in the case of repaired thin panels shown in the pre
vious studies. (C) 1999 Elsevier Science Ltd. All rights reserved.