Authors
Citation
Cp. Wong, Contributions from the Second International Symposium on Electronic Packaging Technology - Foreword, IEEE T COMP, 22(1), 1999, pp. 5-5
Categorie Soggetti
Material Science & Engineering
Journal title
IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES
ISSN journal
15213331
→ ACNP
Volume
22
Issue
1
Year of publication
1999
Pages
5 - 5
Database
ISI
SICI code
1521-3331(199903)22:1<5:CFTSIS>2.0.ZU;2-X