A new, nondestructive junction depth measurement technique for HgCdTe photo
voltaic devices is investigated. The technique uses a scanning laser micros
cope to obtain laser beam induced current (LBIC) data from which informatio
n regarding the junction depth is extracted, and is applicable to both homo
junction and heterojunction diodes. For implanted heterojunction photodiode
s, the position of the n-p junction relative to the heterojunction is an im
portant factor determining completed device performance, with blind photodi
odes resulting if the n-p junction is incorrectly placed. At present, the o
nly methods available for junction depth determination (e.g., secondary ion
mass spectroscopy and differential Hall) are destructive and not applicabl
e as routine process monitoring techniques. It is envisaged that the develo
pment of a nondestructive routine process monitoring procedure will help im
prove yield and reduce the cost of HgCdTe photovoltaic devices. In this pap
er, experimental and theoretical results are presented in order to assess t
he sensitivity of the new technique to the effects of junction doping densi
ty, illumination wavelength, frontside/backside illumination, and test stru
cture geometry.