As liquid phase epitaxial (LPE) growth and array fabrication processes have
matured to give excellent wafer average performance, the yield limiter for
infrared focal plane arrays (IRFPAs), especially large ones, have become o
utages. In this work, significant progress has been made in identifying the
source and eliminating outages from LPE grown Hg1-xCdxTe P-on-n structures
. Historically, studies of the sources of outages have employed defect etch
es to look for dislocations and other crystalline defects, and secondary io
n mass spectroscopy (SIMS), imaging SIMS, and sputter initiated resonance i
on spectrometry (SIRIS) to look for impurities at critical interfaces. Usin
g these techniques, trends were established, but direct correlation with ou
tages have been observed. In LPE grown materials, where the dislocation den
sities are always below 5 x 10(5) cm(-2), and often below 1 x 10(5) cm(-2)
on CdZnTe substrates, dislocations only account for a few outages. In order
to understand the source(s) of outages, a failure analysis was performed o
n several long wavelength IRFPAs. Using a dilute etchant, the metals and th
en cap layers of some 64 x 64 pixel IRFPAs which had excellent average perf
ormance, but suffered from a high density of pixels with excessive leakage
current, were removed. Using a scanning electron microscope with energy dis
persive spectroscopy capability, the presence of carbon particles was corre
lated with excessive leakage current on a 1:1 pixel basis. A series of expe
riments was then conducted which isolated the source of the particles to th
e cap layer growth process, which was consequently changed to eliminate the
m. The process improvements have reduced the particle density to below the
measurement limit of the optical measurement technique implemented to monit
or the density of particles on witness wafers. These improvements are resul
ting in IRFPAs with significantly improved operability.