Development of dry processing techniques for CdZnTe surface passivation

Citation
Mj. Mescher et al., Development of dry processing techniques for CdZnTe surface passivation, J ELEC MAT, 28(6), 1999, pp. 700-704
Citations number
15
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science
Journal title
JOURNAL OF ELECTRONIC MATERIALS
ISSN journal
03615235 → ACNP
Volume
28
Issue
6
Year of publication
1999
Pages
700 - 704
Database
ISI
SICI code
0361-5235(199906)28:6<700:DODPTF>2.0.ZU;2-U
Abstract
A method for passivating the surface of Cd1-xZnxTe (CZT) x-ray and gamma ra y detectors using relatively simple dry processing techniques has been deve loped. Leakage currents were significantly reduced for several processing m ethods. CZT samples were exposed to an oxygen plasma and/or coated with a r eactively sputtered silicon nitride layer. Several parameters of the oxygen plasma step were found to be important for achieving enhanced surface resi stivity. SiNx has been previously characterized and was used because of its high dielectric quality and low deposition temperature. Reduction in leaka ge current after passivation by a factor of as much as twenty is demonstrat ed. Results are also presented which give a measure of the long-term stabil ity of the passivating layers.