Nanoscale embossing of polymers using a thermoplastic die

Citation
Bg. Casey et al., Nanoscale embossing of polymers using a thermoplastic die, MICROEL ENG, 46(1-4), 1999, pp. 125-128
Citations number
7
Categorie Soggetti
Eletrical & Eletronics Engineeing
Journal title
MICROELECTRONIC ENGINEERING
ISSN journal
01679317 → ACNP
Volume
46
Issue
1-4
Year of publication
1999
Pages
125 - 128
Database
ISI
SICI code
0167-9317(199905)46:1-4<125:NEOPUA>2.0.ZU;2-U
Abstract
In this paper we present a novel mechanical pattern transfer process where direct written perspex substrates are used as the master dies for embossing . Using this nanofabrication process we have produced efficient diffractive optical elements. The yield, repeatability and efficiency of the original perspex samples are excellent and these characteristics are carried over in to the replicas. At a smaller scale we have fabricated arrays of 60nm diame ter nanopillars with excellent uniformity over large areas which have been successfully applied in cell engineering applications.