Hot Electron Emission Lithography: a method for efficient large area e-beam projection

Citation
M. Poppeller et al., Hot Electron Emission Lithography: a method for efficient large area e-beam projection, MICROEL ENG, 46(1-4), 1999, pp. 183-186
Citations number
13
Categorie Soggetti
Eletrical & Eletronics Engineeing
Journal title
MICROELECTRONIC ENGINEERING
ISSN journal
01679317 → ACNP
Volume
46
Issue
1-4
Year of publication
1999
Pages
183 - 186
Database
ISI
SICI code
0167-9317(199905)46:1-4<183:HEELAM>2.0.ZU;2-Q
Abstract
We have developed an electron lithography method, Hot Electron Emission Lit hography (HEEL), which is capable of printing integrated circuits with an e xposure time of only a few seconds. The basic design of the mask, manufactu red by standard MOS technology, will be discussed. Patterns printed into e- beam resist by a 1:1 projection system show the applicability of the mask f or lithography purposes. The minimum feature size projected so far is 160 n m in a system capable of 90 nm resolution. Further improvements in resoluti on to 50 nm are possible.