We present a method for line width control in electron beam lithography, wh
ich is especially suited for the manufacture of diffractive optical element
s. By defocusing the spot of our "gaussian beam" electron beam writer, the
line width can be controlled continuously from the 100 nm range to many mic
rons. Test exposures at a beam energy of 2.5 keV with varying defocus and l
ine dose values have been evaluated. It is shown that a simple analytical e
xpression can predict the line widths with high precision down to 300 nm. B
y an empirical modification, we were able to extend our model down to 100 n
m line width. As an example of the method's usefulness, the fabrication of
Fresnel zone plates for x-ray microfocussing applications is described.