SOI wafer flow process for stencil mask fabrication

Authors
Butschke, J Ehrmann, A Hofflinger, B Irmscher, M Kasmaier, R Letzkus, F Loschner, H Mathuni, J Reuter, C Schomburg, C Springer, R
Citation
J. Butschke et al., SOI wafer flow process for stencil mask fabrication, MICROEL ENG, 46(1-4), 1999, pp. 473-476
Citations number
5
Categorie Soggetti
Eletrical & Eletronics Engineeing
Journal title
MICROELECTRONIC ENGINEERING
ISSN journal
01679317 → ACNP
Volume
46
Issue
1-4
Year of publication
1999
Pages
473 - 476
Database
ISI
SICI code
0167-9317(199905)46:1-4<473:SWFPFS>2.0.ZU;2-#
Abstract
A high yield fabrication process for stencil mask using SOI material is pre sented. Membranes and masks from different base materials have been fabrica ted. The stress of the membrane, depending on the doping level, has been de termined. Initial pattern displacement measurements have been performed.