Effects of N-2 plasma treatment of titanium nitride borophosphosilicate glass patterned substrates on metal organic chemical vapor deposition of copper

Effects of N-2 plasma treatment of titanium nitride (TiN)/borophosphosilica te glass (BPSG) substrates on chemical vapor deposition(CVD) of copper(Cu) films were studied. Selective Cu-CVD on TiN in the presence of BPSG was ach ieved bp N-2 plasma treatment prior to the Cu deposition. The Cu deposition temperature, the plasma treatment temperature and the plasma power were cr itical factors for the selective Cu deposition. The X-ray photoelectron spe ctroscopy (XPS) results revealed that the reduction of OH groups of BPSG co ntributed to the selective CVD of Cu films. Surface morphologies, electrica l resistivities, and (111) orientations of the Cu films selectively deposit ed on N-2 plasma treated TiN were as good as or better than those of Cu fil ms deposited on untreated TiN. (C) 1999 Elsevier Science S.A. All rights re served.