Solderable film for bottom side of semiconductor chips

Authors
Zelenka, J
Citation
J. Zelenka, Solderable film for bottom side of semiconductor chips, THIN SOL FI, 348(1-2), 1999, pp. 1-2
Citations number
1
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science","Material Science & Engineering
Journal title
THIN SOLID FILMS
ISSN journal
00406090 → ACNP
Volume
348
Issue
1-2
Year of publication
1999
Pages
1 - 2
Database
ISI
SICI code
0040-6090(19990706)348:1-2<1:SFFBSO>2.0.ZU;2-U
Abstract
For montage of semiconductor chips there is for many applications a need fo r solderable film for the bottom side of the chips. This letter contains a description of a new preparation method of thin film with very low solderin g velocity, perfect surface coverage with solder, high firmness of connecti on, and good ohmic contact on both types of the semiconductors. (C) 1999 El sevier Science S.A. All rights reserved.