For montage of semiconductor chips there is for many applications a need fo
r solderable film for the bottom side of the chips. This letter contains a
description of a new preparation method of thin film with very low solderin
g velocity, perfect surface coverage with solder, high firmness of connecti
on, and good ohmic contact on both types of the semiconductors. (C) 1999 El
sevier Science S.A. All rights reserved.