Ambient-dried SiO2 aerogel thin films and their dielectric application

Citation
Hs. Yang et al., Ambient-dried SiO2 aerogel thin films and their dielectric application, THIN SOL FI, 348(1-2), 1999, pp. 69-73
Citations number
14
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science","Material Science & Engineering
Journal title
THIN SOLID FILMS
ISSN journal
00406090 → ACNP
Volume
348
Issue
1-2
Year of publication
1999
Pages
69 - 73
Database
ISI
SICI code
0040-6090(19990706)348:1-2<69:ASATFA>2.0.ZU;2-8
Abstract
Two step-derived SiO2 sol was deposited on Si(100) substrate via spin coati ng. After aging and washing of wet gel film, surface modification with TMCS (trimethylchlorosilane) was followed to prevent additional condensation re action during drying. Dried films were heated at different temperatures. Th e effects of heating temperature on the chemical bonding state of SiO2 thin film were investigated by means of FTIR and XPS analyses. After heating at different temperatures (200-500 degrees C), crack-free SiO2 thin films wer e synthesized with thickness of 300-500 nm, refractive indices of 1.23-1.15 and dielectric constant of 2.2-2.8. Also the film heated at 300 degrees C exhibited leakage current density below 10(-5) A/cm(2) under an electrical field of 2 MV/cm. (C) 1999 Elsevier Science S.A. All rights reserved.